Intel’s advanced chip packaging service is attracting growing interest from customers, with total commitments reaching billions of dollars this year alone.
Advanced chip packaging has become a vital part of the semiconductor industry, just as important as the chip itself.
With the pace of Moore’s Law transistor miniaturization slowing, manufacturers like NVIDIA have turned to this solution to increase performance without relying entirely on process miniaturization.
Currently, TSMC has a near-monopoly on meeting the demand for advanced packaging, with products like CoWoS-L widely used in AI chip architectures.
The problem is that the supply from this Taiwanese chip manufacturer is extremely limited, even rarer than that of conventional chips.
This opens up opportunities for Intel Foundry, currently the only company with a range of advanced encapsulation solutions comparable to that of TSMC. According to WIRED, Google and Amazon are in talks with Intel to use its EMIB encapsulation service.
Both companies design their own chips, but outsource some of their manufacturing. More specifically, Google’s TPU chips and Amazon’s Trainium chips could integrate Intel’s EMIB-T technology in future generations.
CFO David Zinsner previously said customers were willing to sign commitments and accept upfront payments totaling billions of dollars to reserve production capacity, demonstrating their confidence in Intel’s EMIB technology and other packaging solutions.
One of TSMC’s weaknesses is that most of its advanced packaging production capacity is concentrated in Taiwan, which poses geopolitical risks and limits its ability to serve new customers.
The CoWoS production lines are now almost entirely occupied by historic customers. As a result, Intel remains the only viable option for chip design companies and large technology companies looking for a partner that specializes in advanced packaging.
According to the roadmap announced by Intel, details of its commitment to its customers should be revealed during the second half of 2026. More precise information could be communicated during the next publication of results, scheduled for April 23.
Source : https://khoahocdoisong.vn/intel-vuot-tsmc-gianh-hop-dong-dong-goi-chip-ai-cho-google-va-amazon-post2149096021.html
